• Strong Adhesion UV Curable Dicing Tape for Semiconductor and Wafer Cutting
  • Strong Adhesion UV Curable Dicing Tape for Semiconductor and Wafer Cutting
  • Strong Adhesion UV Curable Dicing Tape for Semiconductor and Wafer Cutting
  • Strong Adhesion UV Curable Dicing Tape for Semiconductor and Wafer Cutting
  • Strong Adhesion UV Curable Dicing Tape for Semiconductor and Wafer Cutting

Strong Adhesion UV Curable Dicing Tape for Semiconductor and Wafer Cutting

Color: Translucent
Material: Pet/Po
Waterproof: Waterproof
Adhesive Type: Acrylic
Application: Glass, Memes Chips, Wafer
UV Exposure Rate [Mj/Cm2]: 300 - 500mj
Samples:
US$ 1/Roll 1 Roll(Min.Order)
| Request Sample
Customization:
Manufacturer/Factory & Trading Company

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Guangdong, China
Cooperated with Fortune 500
This supplier has Cooperated with Fortune 500 companies
R&D Capabilities
The supplier has 4 R&D engineers, you can check the Audit Report for more information
Management Certification
The supplier has quality management system certification, including:
ISO9001:2015 certificate
ISO14001
IATF 16949 Certificate
Digital Management Enterprise
The supplier enhances business efficiency through digitalization, which involves:
-Implementing a digitalization process
-Developing a technical transformation plan
-Real-time monitoring of big data
-Utilizing an ERP system for digital management
-Employing an OA system to streamline processes
-Implementing a CRM system for customer relationship management
-Adopting a SAP system for internal financial management
-Utilizing an AI model for processing big data and enabling decision-making
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  • Overview
  • Product Description
  • Feature
  • Product Parameters
  • Application
  • Quality control
  • Packaging & Shipping
  • FAQ
  • Company Profile
Overview

Basic Info.

Model NO.
P4618
180 Peel Strength (Before UV) [N/Inch]
20
180 Peel Strength (After UV) [N/Inch]
0.05 - 0.1
Transport Package
Carton
Specification
0.16mm*1200mm*100M
Trademark
YOUSAN
Origin
China
Production Capacity
10000

Product Description

Strong Adhesion UV Curable Dicing Tape for Semiconductor and Wafer Cutting
Product Description
UV tape is made of PET/PO material, coated with high performance UV photosensitive acrylic pressure sensitive adhesive.
Strong Adhesion UV Curable Dicing Tape for Semiconductor and Wafer Cutting
Feature

1. High viscosity before UV irradiation and low viscosity after UV irradiation
2. Good adhesion
3. Peels off easily without leaving any residue
4. Acid and alkali resistant
5. Thickness range from 0.08 to 0.16mm(Customization)
Strong Adhesion UV Curable Dicing Tape for Semiconductor and Wafer Cutting

Product Parameters
Product code P4640 P4611 P4662 P4616 P4618
Color Translucent Translucent Translucent Translucent Translucent
Total Thickness{mm} 0.08 0.11 0.155 0.16 0.16
Backing Thickness{mm} 0.05 0.1 0.14 0.14 0.14
Backing PET PET PO PO PO
Adhesive Acrylic Acrylic Acrylic Acrylic Acrylic
180 degree Peel Strength(Before UV) [N/inch] 20 8 12 10 20
180 degree Peel Strength(After UV) [N/inch] 0.05~0.1 0.03~0.06 0.15~0.25 0.3~0.5 0.05~0.1
UV Exposure Rate[mJ/cm2] 300~500mj 300~500mJ 300~500mJ 300~500mJ 300~500mJ
Application Glass Glass MEMS CHIPS Ceramics Wafer

Strong Adhesion UV Curable Dicing Tape for Semiconductor and Wafer Cutting

Application

Its primary role is to lessen adhesion, make operation easier, and increase job efficiency. Semiconductor cutting, wafer cutting, glass/lens cutting, PCB cutting, and LED lamp core cutting are all common applications.Strong Adhesion UV Curable Dicing Tape for Semiconductor and Wafer CuttingStrong Adhesion UV Curable Dicing Tape for Semiconductor and Wafer Cutting

Quality control

Strong Adhesion UV Curable Dicing Tape for Semiconductor and Wafer CuttingStrong Adhesion UV Curable Dicing Tape for Semiconductor and Wafer Cutting

Packaging & Shipping

1,Standard export Paper package or OEM

2,Delivery in 2 workdays after deposit confirm            

3,Shipping by TNT, UPS ,DHL,FEDEX (IE), Aramex or by Air or by Sea

4,Loading Port: Shenzhen or Hongkong.Strong Adhesion UV Curable Dicing Tape for Semiconductor and Wafer CuttingStrong Adhesion UV Curable Dicing Tape for Semiconductor and Wafer Cutting

FAQ

Q1: Are you trade company or manufacturer?
R: Manufacturer, Shenzhen You-San Technology Co.,Limited was established in 1998,with 20 years experience in tape filed business,We are specilized in High Temperature Tape & Double sided Foam Tape.

Q2: Can you print our logo or do special packaging?
R: We can print customer's logo on the tape and paper core and cartons.
We can do any special packaging as required, such as individual shrink with logo card, barcode lable, blister card or anyrequest.

Q3: Can i get some free samples for testing before placing order?
R: Yes, we can provide you some free samples for your reference if you would like to pay delivery fee.

Q4: How can we get detailed price list?
R: Please offer us detailed products & specification (length,width,thickness),color, application and other requirements according to your own needs so that we can give you an accurate quotation.

Q5: What about the payment?
A: 30% deposit in advance, 70% balance by T/T ,Paypal,or MoneyGram before shipment.

 

Company Profile

Shenzhen You-San Technology Co., Ltd. was established in 1997. It is a diversified group company covering industrial tapes, film products and die-cutting divisions. As an innovative enterprise integrating R&D, production and sales, we are proud of our R&D team with adhesive and precision coating technologies, covering polymer synthesis, polymer rheology technology, high-performance film research, precision coating and High-precision die-cutting manufacturing and other fields. We provide customers with full-process adhesive tape application solutions.

Headquartered in the Shenzhen Special Economic Zone, the innovation capital of mainland China, it also has production bases and sales departments in Hong Kong, Dongguan, Huizhou, Kunshan, Xiamen, Yancheng and Jinhua. We not only meet the needs of domestic customers, but also actively participate in global economic integration and international industrial division of labor, and strive to integrate into the global supply chain.

The company has always adhered to the principles of quality first, innovative development, and customer satisfaction as its highest pursuit. In addition, we provide ODM and OEM services to meet customers' personalized needs.Strong Adhesion UV Curable Dicing Tape for Semiconductor and Wafer CuttingStrong Adhesion UV Curable Dicing Tape for Semiconductor and Wafer CuttingDo you have any other questions? pls feel free to contact us directly! we will reply you with 12 hours !!

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Diamond Member Since 2023

Suppliers with verified business licenses

Manufacturer/Factory & Trading Company
Number of Employees
51
Year of Establishment
2016-10-28